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Co-authors
Xu XiaoProfessor, ESE, University of Electronic Science and Technology of ChinaVerified email at uestc.edu.cn
Bin Hu (胡彬)Huazhong University of Science and TechnologyVerified email at hust.edu.cn
Zhao WANG (王钊)Hubei University (湖北大学)Verified email at hubu.edu.cn
Teng ZhaiNanjing University of Science and TechnologyVerified email at njust.edu.cn
TIANPENG DINGResearch Fellow, National University of SingaporeVerified email at nus.edu.sg
Yuan GaoCETCVerified email at connect.ust.hk
Huanyu Jin (金桓宇)Research Fellow, The University of AdelaideVerified email at adelaide.edu.au
Kaifu HUOHuazhong University of Science and TechnologyVerified email at hust.edu.cn
Peihua YangWuhan UniversityVerified email at whu.edu.cn
Kang Liu (刘抗)Wuhan UniversityVerified email at whu.edu.cn
Dmitri GolbergDistinguished Professor, Queensland University of Technology (QUT), Brisbane, AustraliaVerified email at qut.edu.au
Yoshio BandoUniversity of Wollongong, Distinguished Professor/ Tianjin University, Professor/ National Institute for Materials Science, Executive AdvisorVerified email at uow.edu.au
Prof.Dr. Yuebin Li (李岳彬)湖北大学物理与电子科学学院Verified email at hubu.edu.cn
Ting SongScientist @Amgen Inc.Verified email at ucdavis.edu
Zhang Weihai香港城市大学Verified email at my.cityu.edu.hk
Guozhen Shen/沈国震Institute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
Zhong QizeNanyang Technological University; Huazhong University of Science and TechnologyVerified email at ntu.edu.sg
haoshuang gu湖北大学物理学与电子科学学院
YONGMING HUHubei University