Cyril Buttay
Cyril Buttay
Laboratoire Ampère, CNRS UMR 5005
Verified email at - Homepage
Cited by
Cited by
A comparative study of predictive current control schemes for a permanent-magnet synchronous machine drive
F Morel, X Lin-Shi, JM Retif, B Allard, C Buttay
IEEE transactions on industrial electronics 56 (7), 2715-2728, 2009
State of the art of high temperature power electronics
C Buttay, D Planson, B Allard, D Bergogne, P Bevilacqua, C Joubert, ...
Materials Science and Engineering: B 176 (4), 283-288, 2011
Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
J Li, CM Johnson, C Buttay, W Sabbah, S Azzopardi
Journal of Materials Processing Technology 215, 299-308, 2015
Power electronic package having two substrates with multiple semiconductor chips and electronic components
RK Malhan, CM Johnson, C Buttay, J Rashid, F Udrea
US Patent 7,999,369, 2011
Thermal stability of silicon carbide power diodes
C Buttay, C Raynaud, H Morel, G Civrac, ML Locatelli, F Morel
IEEE Transactions on electron devices 59 (3), 761-769, 2012
Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs
C Chen, D Labrousse, S Lefebvre, M Petit, C Buttay, H Morel
Microelectronics Reliability 55 (9-10), 1708-1713, 2015
Die attach of power devices using silver sintering-bonding process optimization and characterization
C Buttay, A Masson, J Li, MC Johnson, M Lazar, C Raynaud, H Morel
HiTEN 2011, 1-7, 2011
Protruding ceramic substrates for high voltage packaging of wide bandgap semiconductors
H Reynes, C Buttay, H Morel
2017 IEEE 5th workshop on wide bandgap power devices and applications (WiPDA …, 2017
Packaged Ga2O3 Schottky Rectifiers With Over 60-A Surge Current Capability
M Xiao, B Wang, J Liu, R Zhang, Z Zhang, C Ding, S Lu, K Sasaki, GQ Lu, ...
IEEE Transactions on Power Electronics 36 (8), 8565-8569, 2021
Design and implementation of integrated common mode capacitors for SiC-JFET inverters
R Robutel, C Martin, C Buttay, H Morel, P Mattavelli, D Boroyevich, ...
IEEE transactions on power electronics 29 (7), 3625-3636, 2013
Compact double-side liquid-impingement-cooled integrated power electronic module
CM Johnson, C Buttay, SJ Rashid, F Udrea, GAJ Amaratunga, P Ireland, ...
Proceedings of the 19th International Symposium on Power Semiconductor …, 2007
Migration issues in sintered-silver die attaches operating at high temperature
R Riva, C Buttay, B Allard, P Bevilacqua
Microelectronics Reliability 53 (9-11), 1592-1596, 2013
High performance cooling system for automotive inverters
C Buttay, J Rashid, CM Johnson, P Ireland, F Udrea, G Amaratunga, ...
2007 European Conference on Power Electronics and Applications, 1-9, 2007
Wave transmission reduction by a piezoelectric semi-passive technique
A Faiz, D Guyomar, L Petit, C Buttay
sensors and Actuators A: Physical 128 (2), 230-237, 2006
Application of the PCB-embedding technology in power electronics–State of the art and proposed development
C Buttay, C Martin, F Morel, R Caillaud, J Le Leslé, R Mrad, N Degrenne, ...
2018 Second International Symposium on 3D Power Electronics Integration and …, 2018
Thermal management and electromagnetic analysis for GaN devices packaging on DBC substrate
C Yu, C Buttay, E Laboure
IEEE Transactions on Power Electronics 32 (2), 906-910, 2016
Robustness in short-circuit mode of SiC MOSFETs
C Chen, D Labrousse, S Lefebvre, M Petit, C Buttay, H Morel
Proceedings of PCIM Europe 2015; International Exhibition and Conference for …, 2015
Real-time compact electronic thermal modelling for health monitoring
M Musallam, C Buttay, M Whitehead, M Johnson
2007 European Conference on Power Electronics and Applications, 1-10, 2007
Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy
W Sabbah, S Azzopardi, C Buttay, R Meuret, E Woirgard
Microelectronics Reliability 53 (9-11), 1617-1621, 2013
Full densification of molybdenum powders using spark plasma sintering
B Mouawad, M Soueidan, D Fabregue, C Buttay, V Bley, B Allard, H Morel
Metallurgical and Materials Transactions A 43, 3402-3409, 2012
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