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Co-authors
Dane MorganUniversity of Wisconsin, Materials ScienceVerified email at wisc.edu- Yifei MoUniversity of Maryland, College ParkVerified email at umd.edu
- Paul VoylesUniversity of Wisconsin, MadisonVerified email at wisc.edu
- Narasimhan SwaminathanAssociate Professor, Indian Institute of TechnologyVerified email at iitm.ac.in
- Priya VashishtaProfessor Materials Science, University of Southern CaliforniaVerified email at usc.edu
- Yun LiuApple Inc.Verified email at fas.harvard.edu
- Robert W. CarpickJohn Henry Towne Professor and Chair, Department of Mechanical Engineering and Applied MechanicsVerified email at seas.upenn.edu
- Arkadiusz WójsWroclaw University of Science and TechnologyVerified email at pwr.edu.pl
- Tyler GerczakOak Ridge National LaboratoryVerified email at ornl.gov
- Maneesh MishraPhD, Materials Science and Engineering, University of Wisconsin MadisonVerified email at micron.com
- Chao JiangIdaho National LaboratoryVerified email at inl.gov
- Leland BarnardMayo ClinicVerified email at mayo.edu
- Kevin T. TurnerProfessor of Mechanical Engineering and Applied Mechanics, University of PennsylvaniaVerified email at seas.upenn.edu
- Yutai KatohMaterials Science and Technology Division, Oak Ridge National LaboratoryVerified email at ornl.gov
- George B. BokasSiemens Industry SoftwareVerified email at siemens.com
- Steven ShannonNorth Carolina State UniversityVerified email at ncsu.edu
- William J. WeberGovernor's Chair Professor, University of TennesseeVerified email at utk.edu
- Lance SneadMassachusetts Institute of TechnologyVerified email at MIT.edu
- Marcin WojdyrGlobal Phasing Ltd. and CCP4Verified email at diamond.ac.uk
- GR OdetteProfessor University of California Santa BarbaraVerified email at engineering.ucsb.edu
Izabela Szlufarska
Professor of Materials Science & Engineering, University of Wisconsin
Verified email at wisc.edu