| An agent-based approach for modeling and simulation of human resource management as a complex system: Management strategy evaluation KUS Somarathna Simulation Modelling Practice and Theory 104, 102118, 2020 | 28 | 2020 |
| Reliability of screen-printed conductors and resistors during fatigue cycling on flexible substrate B Garakani, KUS Somarathna, DL Weerawarne, MD Poliks, A Alizadeh International Symposium on Microelectronics 2019 (1), 000139-000146, 2019 | 18 | 2019 |
| A study of electromechanical behaviors of printed conductive leads on stretchable textiles for smart clothing KUS Somarathna, B Garakani, M Alhendi, E Enakerakpo, P Borgesen, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2157-2166, 2020 | 14 | 2020 |
| Evaluation of an anisotropic conductive epoxy for interconnecting highly stretchable conductors to various surfaces R Al-Haidari, B Garakani, M Alhendi, US Somarathna, MD Poliks, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1422-1429, 2022 | 12 | 2022 |
| Optimizing the Emergency Delivery of Medical Supplies with Unmanned Aircraft Vehicles SS Walia, KUS Somarathna, R Hendricks, A Jackson, N Nagarur IISE Annual Conference, 1588-1593, 2018 | 12 | 2018 |
| Electromechanical characterization of a highly stretchable liquid metal derived conductor for wearable electronics B Garakani, KUS Somarathna, GS Khinda, RS Sivasubramony, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 762-768, 2021 | 10 | 2021 |
| Fully Additive Manufacturing of Passive Circuit Elements using Aerosol Jet Printing E Enakerakpo, M Alhendi, GS Khinda, B Garakani, KUS Somarathna, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1138-1143, 2021 | 10 | 2021 |
| Printed stretchable conductors for smart clothing: the effect of conductor geometry and substrate properties on electromechanical behaviors KUS Somarathna, GS Khinda, B Garakani, EM Abbara, N Stoffel, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 500-506, 2021 | 10 | 2021 |
| Effects of process parameters and isothermal fatigue cycling on electromechanical properties of screen-printed interconnect on nonwovens for wearable electronics B Garakani, KUS Somarathna, GS Khinda, E Enakerakpo, M Alhendi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2167-2174, 2020 | 10 | 2020 |
| Robustness and reliability of novel anisotropic conductive epoxy for stretchable wearable electronics A Stennermann, D Balder, M Stennermann, C Tabor, N Stoffel, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 762-768, 2022 | 7 | 2022 |
| High Temperature Die Interconnection Approaches F Alshatnawi, M Alhendi, RA Al-Haidari, RS Sivasubramony, EM Abbara, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1539-1545, 2022 | 7 | 2022 |
| Screen-printed Water-soluble Resistors for Wearable Electronics: An Analysis of the Fabrication Process KUS Somarathna, B Garakani, DL Weerawarne, GS Khinda, A Burns, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2285-2292, 2021 | 5 | 2021 |
| Current Carrying Capacity of Inkjet-Printed Nano-Silver Interconnects on Mesoporous PET Substrate EM Abbara, GS Khinda, M Alhendi, R Alhaidari, F Alshatnawi, B Garakani, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 794-800, 2022 | 4 | 2022 |
| Fabrication, Characterization, and Electromechanical Reliability of Stretchable Circuitry for Health Monitoring Systems B Garakani, KUS Somarathna, R Al-Haidari, FW Alshatnavi, DM Smilgies, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1524-1530, 2022 | 3 | 2022 |
| Investigation of electromechanical reliability and radio frequency performance of a highly stretchable liquid metal conductor for wearable electronics B Garakani, US Somarathna, A Umar, GS Khinda, MYM Abdelatty, ... Journal of Electronic Packaging 145 (3), 031006, 2023 | 2 | 2023 |
| Application of Discrete-Event Simulation for an Airport System Optimization KUS Somarathna, S Abedi, S Karimi, K Yakkala, N Karami, D Won IIE Annual Conference. Proceedings, 1389-1394, 2020 | 2 | 2020 |
| Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing R Al-Haidari, M Alhendi, D Richmond, EM Abbara, A Obeidat, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 668-675, 2023 | 1 | 2023 |
| The Effect of Thermal Stress on the Reliability of all-Printed Vias on Flexible Substrates US Somarathna, M Alhendi, B Garakani, MD Poliks, DL Weerawarne, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1629-1636, 2022 | 1 | 2022 |
| Recommendation System for Customer Preferred Mental Healthcare Facility KUS Somarathna, SS Walia, LSN Manchuri, D Won IISE Annual Conference, 509-514, 2018 | 1 | 2018 |
| Passive UHF-RFID Tag With Printed Security Features for Authentication and Tamper Resistance E Enakerakpo, A Umar, M Alhendi, R Al-Haidari, DJ Richmond, ... IEEE Journal of Radio Frequency Identification, 2024 | | 2024 |
Mark D PoliksSUNY Distinguished Professor, State University of New York at BinghamtonVerified email at binghamton.edu
