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Souheil Nadri
Souheil Nadri
Research Staff Member at HRL Laboratories
Verified email at virginia.edu
Title
Cited by
Cited by
Year
Reducing error rates in straintronic multiferroic nanomagnetic logic by pulse shaping
K Munira, Y Xie, S Nadri, MB Forgues, MS Fashami, J Atulasimha, ...
Nanotechnology 26 (24), 245202, 2015
352015
An epitaxy transfer process for heterogeneous integration of submillimeter-wave GaAs Schottky diodes on silicon using SU-8
L Xie, S Nadri, N Alijabbari, ME Cyberey, MF Bauwens, AW Lichtenberger, ...
IEEE Electron Device Letters 38 (11), 1516-1519, 2017
162017
Measurement and extraction of parasitic parameters of quasi-vertical schottky diodes at submillimeter wavelengths
S Nadri, L Xie, M Jafari, MF Bauwens, A Arsenovic, RM Weikle
IEEE Microwave and Wireless Components Letters 29 (7), 474-476, 2019
152019
Thermal characterization of quasi-vertical GaAs Schottky diodes integrated on silicon
S Nadri, CM Moore, ND Sauber, L Xie, ME Cyberey, JT Gaskins, ...
IEEE Transactions on Electron Devices 66 (1), 349-356, 2018
92018
Submillimeter-wave schottky diodes based on heterogeneous integration of GaAs onto silicon
RM Weikle, L Xie, S Nadri, M Jafari, CM Moore, N Alijabbari, ME Cyberey, ...
2019 United States National Committee of URSI National Radio Science Meeting …, 2019
82019
A 160 GHz frequency Quadrupler based on heterogeneous integration of GaAs Schottky diodes onto silicon using SU-8 for epitaxy transfer
S Nadri, L Xie, M Jafari, N Alijabbari, ME Cyberey, NS Barker, ...
2018 IEEE/MTT-S International Microwave Symposium-IMS, 769-772, 2018
82018
High-performance InGaAs/InP photodiodes on silicon using low-temperature wafer-bonding
Q Yu, Y Wang, L Xie, S Nadri, K Sun, J Zang, Q Li, RM Weikle, A Beling
CLEO: Science and Innovations, SM2I. 1, 2018
52018
Steady-state thermal analysis of an integrated 160 GHz balanced quadrupler based on quasi-vertical Schottky diodes
S Nadri, L Xie, N Alijabbari, JT Gaskins, BM Foley, PE Hopkins, ...
2015 40th International Conference on Infrared, Millimeter, and Terahertz …, 2015
52015
Micromachined probes with integrated GaAs Schottky diodes for on-wafer temperature sensing
L Xie, CM Moore, ME Cyberey, S Nadri, ND Sauber, MF Bauwens, ...
2018 IEEE International Instrumentation and Measurement Technology …, 2018
32018
Micromachined interfaces for metrology and packaging applications in the submillimeter-wave band
RM Weikle, H Li, A Arsenovic, S Nadri, L Xie, MF Bauwens, N Alijabbari, ...
IMAPSource Proceedings 2017 (DPC), 1-36, 2017
32017
10μm Pitch Bumping of Singulated Die Using a Temporary Metal-Embedded Chip Assembly Process
S Nadri, BAC Tu, F Herrault, C Wilt, P Naghibi, M Pavlov, J Wong, V Phan
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1000-1004, 2022
22022
Electronic calibration for submillimeter-wave on-wafer scattering parameter measurements using Schottky diodes
L Xie, MF Bauwens, S Nadri, A Arsenovic, ME Cyberey, AW Lichtenberger, ...
IEEE Transactions on Terahertz Science and Technology 10 (6), 583-592, 2020
22020
A monostatic coded aperture reflectometer for imaging at submillimeter-wavelengths
MB Eller, ND Sauber, A Arsenovic, S Nadri, L Xie, RM Weikle
2017 IEEE MTT-S International Microwave Symposium (IMS), 1207-1209, 2017
22017
An Integrated 100-element schottky varactor diode array for sideband generation at 1.6 THz
S Hawasli, S Nadri, L Xie, RM Weikle
2016 IEEE MTT-S International Microwave Symposium (IMS), 1-4, 2016
22016
Reducing error rates in straintronic multiferroic dipole-coupled nanomagnetic logic by pulse shaping
K Munira, Y Xie, S Nadri, MB Forgues, MS Fashami, J Atulasimha, ...
arXiv preprint arXiv:1405.4000, 2014
22014
System and method for integrating diode sensors on micromachined wafer probes
RM Weikle, XIE Linli, ME Cyberey, S Nadri, MF Bauwens, ...
US Patent App. 17/053,930, 2021
12021
Electronic calibration of one-port networks at submillimeter wavelengths using Schottky diodes as on-wafer standards
L Xie, MF Bauwens, S Nadri, ME Cyberey, A Arsenovic, AW Lichtenberger, ...
2019 93rd ARFTG Microwave Measurement Conference (ARFTG), 1-4, 2019
12019
Terahertz diode arrays and differential probes based on heterogeneous integration and silicon micromachining
RM Weikle, C Zhang, S Hawasli, S Nadri, L Xie, NS Barker, ...
Additional Papers and Presentations 2016 (DPC), 000924-000962, 2016
12016
Process Design Kit and Initial Demonstration of Digital Metal-Embedded Chip Assembly for High Density IO Fan-Out Packaging
S Nadri, BAC Tu, F Herrault, H Sharifi, J McCue, A Khan, D Schwan, ...
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 623-628, 2023
2023
Micro-printing of ceramic packaging for sensor integration
T Schaedler, KA Porter, CY Alex, ES Wernick, S Soukiazian, T Sasse, ...
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVI …, 2023
2023
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