Follow
Dr.-Ing. Nagarajan Palavesam
Dr.-Ing. Nagarajan Palavesam
Research Associate, Fraunhofer EMFT
Verified email at emft.fraunhofer.de - Homepage
Title
Cited by
Cited by
Year
Roll-to-roll processing of film substrates for hybrid integrated flexible electronics
N Palavesam, S Marin, D Hemmetzberger, C Landesberger, K Bock, ...
1092018
Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
C Landesberger, N Palavesam, W Hell, A Drost, R Faul, H Gieser, ...
2016 International Conference on Electronics Packaging (ICEP), 473-478, 2016
272016
Mechanical Reliability Analysis of Ultra-thin Chip-on-Foil Assemblies under different types of recurrent bending
N Palavesam, D Bonfert, W Hell, C Landesberger, H Gieser, C Kutter, ...
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1664-1670, 2016
172016
Influence of flexibility of the interconnects on the dynamic bending reliability of flexible hybrid electronics
N Palavesam, W Hell, A Drost, C Landesberger, C Kutter, K Bock
Electronics 9 (2), 238, 2020
122020
Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates
N Palavesam, C Landesberger, K Bock
2014 IEEE 20th International Symposium for Design and Technology in …, 2014
122014
Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates
N Palavesam, C Landesberger, C Kutter, K Bock
2015 11th Conference on Ph. D. Research in Microelectronics and Electronics …, 2015
112015
Conductive layer for charge dissipation during electron-beam exposures
LD Bozano, R Sooriyakumaran, LK Sundberg, MI Sanchez, EM Lofano, ...
Advances in Resist Materials and Processing Technology XXIX 8325, 282-289, 2012
82012
Low profile open MEMS and ASIC packages manufactured by flexible hybrid integration in a roll-to-roll compatible process
I Bose, N Palavesam, C Hochreiter, C Landesberger, C Kutter
2018 48th European Solid-State Device Research Conference (ESSDERC), 102-106, 2018
72018
Dynamic bending reliability analysis of flexible hybrid integrated chip-foil packages
N Palavesam, E Yacoub-George, W Hell, C Landesberger, C Kutter, ...
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 246-250, 2018
62018
A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
N Palavesam, W Hell, A Drost, C Landesberger, C Kutter, K Bock
Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (NOR …, 2019
52019
A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foils
N Palavesam, C Landesberger, C Kutter, K Bock
2016 Smart Systems Integration International Conference and Exhibition, 2016
52016
Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
N Palavesam, D Bonfert, W Hell, C Landesberger, H Gieser, C Kutter, ...
2015 IEEE 21st International Symposium for Design and Technology in …, 2015
52015
Ultra-thin flexible interposer-a flexible hybrid integration approach to replace wire bonds
E Yacoub-George, N Palavesam, W Hell, M König, R Faul, ...
Smart Systems Integration; 13th International Conference and Exhibition on …, 2019
32019
Antenna Module
C Landesberger, P Ramm, N Palavesam, J Weber
US Patent App. 17/156,818, 2021
12021
Thin chip foil packaging: an enabling technology for ultra-thin packages
C Landesberger, N Palavesam, A Drost, W Hell, R Faul, C Kutter
12016
Advanced integration technology for fabricating high-speed electro-optical sub-assembly
N Palavesam, JH Choi, W Hell, G Fiol, KO Velthaus, C Zerna, H Gieser, ...
2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021
2021
Antennenmodul
C Landesberger, P Ramm, N Palavesam, J Weber
2021
Reliability analysis of foil substrate based integration of silicon chips
N Palavesam
Technische Universität Dresden, 2020
2020
Review of the Reliability of Flexible Packaging of Thin and Ultra-Thin ICs
I Bose, N Palavesam, C Landesberger, C Kutter
Advances in Microelectronics: Reviews 1, 2018
2018
Thin chip foil packaging: An enabling technology for ultra-thin packages
CK C Landesberger, N Palavesam, A Drost, W Hell, R Faul
Chip Scale Review 20 (March-April 2016), 15-16, 2016
2016
The system can't perform the operation now. Try again later.
Articles 1–20