| Roll-to-roll processing of film substrates for hybrid integrated flexible electronics N Palavesam, S Marin, D Hemmetzberger, C Landesberger, K Bock, ... | 82 | 2018 |
| Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis C Landesberger, N Palavesam, W Hell, A Drost, R Faul, H Gieser, ... 2016 International Conference on Electronics Packaging (ICEP), 473-478, 2016 | 26 | 2016 |
| Mechanical Reliability Analysis of Ultra-thin Chip-on-Foil Assemblies under different types of recurrent bending N Palavesam, D Bonfert, W Hell, C Landesberger, H Gieser, C Kutter, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1664-1670, 2016 | 15 | 2016 |
| Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates N Palavesam, C Landesberger, K Bock 2014 IEEE 20th International Symposium for Design and Technology in …, 2014 | 12 | 2014 |
| Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates N Palavesam, C Landesberger, C Kutter, K Bock 2015 11th Conference on Ph. D. Research in Microelectronics and Electronics …, 2015 | 11 | 2015 |
| Influence of flexibility of the interconnects on the dynamic bending reliability of flexible hybrid electronics N Palavesam, W Hell, A Drost, C Landesberger, C Kutter, K Bock Electronics 9 (2), 238, 2020 | 10 | 2020 |
| Conductive layer for charge dissipation during electron-beam exposures LD Bozano, R Sooriyakumaran, LK Sundberg, MI Sanchez, EM Lofano, ... Advances in Resist Materials and Processing Technology XXIX 8325, 282-289, 2012 | 8 | 2012 |
| Low profile open MEMS and ASIC packages manufactured by flexible hybrid integration in a roll-to-roll compatible process I Bose, N Palavesam, C Hochreiter, C Landesberger, C Kutter 2018 48th European Solid-State Device Research Conference (ESSDERC), 102-106, 2018 | 7 | 2018 |
| Dynamic bending reliability analysis of flexible hybrid integrated chip-foil packages N Palavesam, E Yacoub-George, W Hell, C Landesberger, C Kutter, ... 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 246-250, 2018 | 6 | 2018 |
| A novel test method for robustness assessment of very small, functional ultra-thin chips embedded in flexible foils N Palavesam, C Landesberger, C Kutter, K Bock 2016 Smart Systems Integration International Conference and Exhibition, 2016 | 5 | 2016 |
| Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending N Palavesam, D Bonfert, W Hell, C Landesberger, H Gieser, C Kutter, ... 2015 IEEE 21st International Symposium for Design and Technology in …, 2015 | 5 | 2015 |
| A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics N Palavesam, W Hell, A Drost, C Landesberger, C Kutter, K Bock Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (NOR …, 2019 | 4 | 2019 |
| Ultra-thin flexible interposer-a flexible hybrid integration approach to replace wire bonds E Yacoub-George, N Palavesam, W Hell, M König, R Faul, ... Smart Systems Integration; 13th International Conference and Exhibition on …, 2019 | 3 | 2019 |
| Thin chip foil packaging: an enabling technology for ultra-thin packages C Landesberger, N Palavesam, A Drost, W Hell, R Faul, C Kutter | 1 | 2016 |
| Advanced integration technology for fabricating high-speed electro-optical sub-assembly N Palavesam, JH Choi, W Hell, G Fiol, KO Velthaus, C Zerna, H Gieser, ... 2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021 | | 2021 |
| Antenna Module C Landesberger, P Ramm, N Palavesam, J Weber US Patent App. 17/156,818, 2021 | | 2021 |
| Antennenmodul C Landesberger, P Ramm, N Palavesam, J Weber | | 2021 |
| Reliability analysis of foil substrate based integration of silicon chips N Palavesam Technische Universität Dresden, 2020 | | 2020 |
| Review of the Reliability of Flexible Packaging of Thin and Ultra-Thin ICs I Bose, N Palavesam, C Landesberger, C Kutter Advances in Microelectronics: Reviews 1, 2018 | | 2018 |
| Thin chip foil packaging: An enabling technology for ultra-thin packages CK C Landesberger, N Palavesam, A Drost, W Hell, R Faul Chip Scale Review 20 (March-April 2016), 15-16, 2016 | | 2016 |
