| The growth and stress vs. strain characterization of the silver solid solution phase with indium Y Huo, CC Lee Journal of Alloys and Compounds 661, 372-379, 2016 | 31 | 2016 |
| Wafer-scale fabrication of CMOS-compatible trapping-mode infrared imagers with colloidal quantum dots S Zhang, C Bi, T Qin, Y Liu, J Cao, J Song, Y Huo, M Chen, Q Hao, ... ACS Photonics 10 (3), 673-682, 2023 | 27 | 2023 |
| A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method Y Huo, SW Fu, YL Chen, CC Lee Journal of Materials Science: Materials in Electronics 27, 10382-10392, 2016 | 25 | 2016 |
| Solid solution softening and enhanced ductility in concentrated FCC silver solid solution alloys Y Huo, J Wu, CC Lee Materials Science and Engineering: A 729, 208-218, 2018 | 20 | 2018 |
| Enhancement mechanism of Te doping on microstructure, wettability and mechanical properties of Sn–Bi-based solder Z Hou, X Zhao, Y Gu, C Tan, Y Huo, S Shi, Y Liu Materials Science and Engineering: A 848, 143445, 2022 | 19 | 2022 |
| Study of anti-tarnishing mechanism in Ag-In binary system by using semi-quantum-mechanical approach Y Huo, J Wu, CC Lee Journal of The Electrochemical Society 164 (7), C418, 2017 | 16 | 2017 |
| Low Temperature VECSEL-to-Diamond Heterogeneous Integration with Ag-In Spinodal Nanostructured Layer R Sheikhi, Y Huo, FG Shi, CC Lee Scripta Materialia 194, 113628, 2021 | 13 | 2021 |
| Exploring the DBR superlattice effect on the thermal performance of a VECSEL with the finite element method Y Huo, CY Cho, KF Huang, YF Chen, CC Lee Optics Letters 44 (2), 327-330, 2019 | 13 | 2019 |
| Direct Ag-Ag bonding by in-situ reduction of surface oxides for advanced chip-package interconnection J Wu, Y Huo, CC Lee Materialia 4, 417-422, 2018 | 13 | 2018 |
| Prior-to-bond annealing effects on the diamond-to-copper heterogeneous integration using silver–indium multilayer structure R Sheikhi, Y Huo, CH Tsai, CR Kao, FG Shi, CC Lee Journal of Materials Science: Materials in Electronics 31, 8059-8071, 2020 | 10 | 2020 |
| Anti-tarnishing evaluations of silver solid solution phase with indium Y Huo, CC Lee 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2180-2187, 2015 | 9 | 2015 |
| Alloying regulation mechanism toward microstructure evolution of Sn-bi-based solder joint under current stress Z Hou, X Zhao, Y Wang, Y Gu, C Tan, X Xie, Y Huo, Y Liu Materials Characterization 191, 112094, 2022 | 8 | 2022 |
| A first-principles computation-driven mechanism study on the solders dilute doping effects to η’-Cu6Sn5 growth kinetics Y Wang, Y Dong, X Zhao, Y Huo, Y Liu Journal of Materials Science 56, 9741-9753, 2021 | 7 | 2021 |
| Atomistic insights into silver-indium solid solution softening mechanism for microelectronics packaging S Zhao, B Zheng, D Zhang, X Xie, Z Qu, Y Wang, X Zhao, J Wu, CC Lee, ... Journal of Materials Research and Technology 24, 6065-6075, 2023 | 6 | 2023 |
| Advanced Electronic Packaging Technology: From Hard to Soft Y Gu, Y Huo Materials 16 (6), 2346, 2023 | 5 | 2023 |
| Plasma-induced growth mechanism of surface-state silver oxide in nanoscale for low-temperature bonding technology T Wang, S Gu, Y Fang, D Zhang, X Xie, Z Qu, Y Wang, X Zhao, J Wu, ... Materials Characterization 199, 112830, 2023 | 4 | 2023 |
| Size-controlled low-melting-point-alloy particle-incorporated transient liquid-phase epoxy composite conductive adhesive with high performances M Yang, Y Liu, D Zhang, C Cao, X Zhao, Y Huo ACS Applied Polymer Materials 5 (4), 2760-2773, 2023 | 4 | 2023 |
| A phase-field model of electrochemical migration for silver-based conductive adhesives C Cao, M Yang, C Liang, D Zhang, X Chen, X Zhao, CC Lee, Y Huo Electrochimica Acta 471, 143388, 2023 | 3 | 2023 |
| Room-temperature, rapid, solid-state solder bonding technology for future ultra-high-density interconnects manufacturing M Yang, Y Huo, X Zhao, Y Guo, Y Liu Journal of Materials Research and Technology 25, 999-1010, 2023 | 2 | 2023 |
| Comparison between bulk and particle solder alloy on the performance of low-melting solder joints M Yang, X Zhao, Y Huo, KN Tu, Y Liu Journal of Materials Research and Technology 24, 71-80, 2023 | 2 | 2023 |
Chin C. LeeProfessor of Electrical Engineering, University of Caifornia, IrvineVerified email at uci.edu
