Follow
Telesphor Kamgaing
Telesphor Kamgaing
Research Scientist, Intel Corporation
Verified email at intel.com
Title
Cited by
Cited by
Year
A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
T Kamgaing, OM Ramahi
IEEE Microwave and wireless components letters 13 (1), 21-23, 2003
2792003
Compact integration of LC resonators
T Kamgaing
US Patent 7,548,138, 2009
1172009
Embedded millimeter-wave phased array module
T Kamgaing, A Elsherbini, V Rao
US Patent 9,773,742, 2017
1092017
Design and modeling of high-impedance electromagnetic surfaces for switching noise suppression in power planes
T Kamgaing, OM Ramahi
IEEE Transactions on electromagnetic compatibility 47 (3), 479-489, 2005
1062005
Integration of switched capacitor networks for power delivery
BS Oraw, T Kamgaing
US Patent 8,582,333, 2013
882013
Series and parallel hybrid switched capacitor networks for IC power delivery
BS Oraw, T Kamgaing
US Patent 8,330,436, 2012
852012
Single-package phased array module with interleaved sub-arrays
T Kamgaing, AA Elsherbini
US Patent 9,413,079, 2016
792016
Radio-and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same
T Kamgaing, VR Rao
US Patent 8,759,950, 2014
662014
Radio-and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same
T Kamgaing, VR Rao
US Patent 8,759,950, 2014
662014
Advanced Package Technologies for High-Performance Systems.
D Mallik, K Radhakrishnan, J He, CP Chiu, T Kamgaing, D Searls, ...
Intel Technology Journal 9 (4), 2005
572005
Multi-layer package with integrated antenna
T Kamgaing, AA Elsherbini, TW Frank
US Patent 10,128,177, 2018
512018
Series and parallel hybrid switched capacitor networks for IC power delivery
BS Oraw, T Kamgaing
US Patent 9,318,952, 2016
452016
Multiband electromagnetic-bandgap structures for applications in small form-factor multichip module packages
T Kamgaing, OM Ramahi
IEEE transactions on microwave theory and techniques 56 (10), 2293-2300, 2008
412008
Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates
T Kamgaing, VR Rao, Y Palaskas
US Patent 8,816,906, 2014
402014
Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates
T Kamgaing, VR Rao, Y Palaskas
US Patent 8,816,906, 2014
402014
Modeling of multilayered media using effective medium theory
FG Hu, J Song, T Kamgaing
19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010
402010
Modeling of frequency dependent losses in two-port and three-port inductors on silicon
T Kamgaing, T Myers, M Petras, M Miller
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No. 02CH37278 …, 2002
402002
Die package with superposer substrate for passive components
T Kamgaing, VR Rao
US Patent 10,615,133, 2020
392020
High performance glass-based 60 ghz/mm-wave phased array antennas and methods of making same
T Kamgaing
US Patent 8,901,688, 2014
372014
High performance glass-based 60 ghz/mm-wave phased array antennas and methods of making same
T Kamgaing
US Patent 8,901,688, 2014
372014
The system can't perform the operation now. Try again later.
Articles 1–20