| Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives L Ye, Z Lai, J Liu, A Tholen IEEE Transactions on Electronics Packaging Manufacturing 22 (4), 299-302, 1999 | 232 | 1999 |
| Novel nanostructured thermal interface materials: a review J Hansson, TMJ Nilsson, L Ye, J Liu International Materials Reviews 63 (1), 22-45, 2018 | 201 | 2018 |
| Overview of conductive adhesive interconnection technologies for LCDs H Kristiansen, J Liu IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 194 | 1998 |
| Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates Z Lai, J Liu IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996 | 193 | 1996 |
| Characterization of liquid crystal polymer for high frequency system-in-a-package applications G Zou, H Gronqvist, JP Starski, J Liu IEEE Transactions on Advanced Packaging 25 (4), 503-508, 2002 | 149 | 2002 |
| Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders C Andersson, Z Lai, J Liu, H Jiang, Y Yu Materials Science and Engineering: A 394 (1-2), 20-27, 2005 | 148 | 2005 |
| Bioactive 3D cell culture system minimizes cellular stress and maintains the in vivo‐like morphological complexity of astroglial cells TB Puschmann, C Zandén, Y De Pablo, F Kirchhoff, M Pekna, J Liu, ... Glia 61 (3), 432-440, 2013 | 141 | 2013 |
| Electrospun polyurethane scaffolds for proliferation and neuronal differentiation of human embryonic stem cells B Carlberg, MZ Axell, U Nannmark, J Liu, HG Kuhn Biomedical Materials 4 (4), 045004, 2009 | 141 | 2009 |
| Functionalization mediates heat transport in graphene nanoflakes H Han, Y Zhang, N Wang, MK Samani, Y Ni, ZY Mijbil, M Edwards, ... Nature Communications 7 (1), 1-9, 2016 | 135 | 2016 |
| A reliable and environmentally friendly packaging technology-flip-chip joining using anisotropically conductive adhesive J Liu, A Tolvgard, J Malmodin, Z Lai IEEE Transactions on Components and Packaging Technologies 22 (2), 186-190, 1999 | 121 | 1999 |
| Improved heat spreading performance of functionalized graphene in microelectronic device application Y Zhang, H Han, N Wang, P Zhang, Y Fu, M Murugesan, M Edwards, ... Advanced Functional Materials 25 (28), 4430-4435, 2015 | 117 | 2015 |
| Graphene related materials for thermal management Y Fu, J Hansson, Y Liu, S Chen, A Zehri, MK Samani, N Wang, Y Ni, ... 2D Materials 7 (1), 012001, 2019 | 109 | 2019 |
| Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots Z Gao, Y Zhang, Y Fu, MMF Yuen, J Liu Carbon 61, 342-348, 2013 | 108 | 2013 |
| Tailoring the thermal and mechanical properties of graphene film by structural engineering N Wang, MK Samani, H Li, L Dong, Z Zhang, P Su, S Chen, J Chen, ... Small 14 (29), 1801346, 2018 | 107 | 2018 |
| Mechanically stretchable and electrically insulating thermal elastomer composite by liquid alloy droplet embedment SH Jeong, S Chen, J Huo, EK Gamstedt, J Liu, SL Zhang, ZB Zhang, ... Scientific reports 5 (1), 1-10, 2015 | 100 | 2015 |
| Low partial pressure chemical vapor deposition of graphene on copper J Sun, N Lindvall, MT Cole, KTT Angel, T Wang, KBK Teo, DHC Chua, ... IEEE transactions on nanotechnology 11 (2), 255-260, 2011 | 92 | 2011 |
| Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy Y Gao, C Zou, B Yang, Q Zhai, J Liu, E Zhuravlev, C Schick Journal of Alloys and Compounds 484 (1-2), 777-781, 2009 | 91 | 2009 |
| Controllable chemical vapor deposition of large area uniform nanocrystalline graphene directly on silicon dioxide J Sun, N Lindvall, MT Cole, T Wang, TJ Booth, P Bøggild, KBK Teo, J Liu, ... Journal of Applied Physics 111 (4), 044103, 2012 | 84 | 2012 |
| Carbon‐nanotube through‐silicon via interconnects for three‐dimensional integration T Wang, K Jeppson, L Ye, J Liu Small 7 (16), 2313-2317, 2011 | 84 | 2011 |
| A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity Y Fu, N Nabiollahi, T Wang, S Wang, Z Hu, B Carlberg, Y Zhang, X Wang, ... Nanotechnology 23 (4), 045304, 2012 | 82 | 2012 |
