| Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys A Skwarek, O Krammer, T Hurtony, P Ptak, K Górecki, S Wroński, ... Nanomaterials 11 (6), 1545, 2021 | 31 | 2021 |
| Modelling of temperature distribution along PCB thickness in different substrates during reflow D Straubinger, I Bozsóki, D Bušek, B Illés, A Géczy Circuit World 46 (2), 85-92, 2020 | 16 | 2020 |
| Novel PLA/flax based biodegradable printed circuit boards A Géczy, A Csiszár, E Rozs, I Hajdu, B Medgyes, O Krammer, ... 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2022 | 11 | 2022 |
| Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs D Straubinger, A Géczy, A Sipos, A Kiss, D Gyarmati, O Krammer, ... Circuit World 45 (1), 37-44, 2019 | 11 | 2019 |
| Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components D Straubinger, T Hurtony, A Géczy Journal of Materials Research and Technology 21, 308-318, 2022 | 10 | 2022 |
| Effects of high current density on lead-free solder joints of chip-size passive SMD components A Geczy, D Straubinger, A Kovacs, O Krammer, P Mach, G Harsányi Soldering & Surface Mount Technology 30 (2), 74-80, 2018 | 8 | 2018 |
| Modelling of thermocouple geometry variations for improved heat transfer monitoring in smart electronic manufacturing environment D Straubinger, B Illés, D Busek, N Codreanu, A Géczy Case Studies in Thermal Engineering 33, 102001, 2022 | 7 | 2022 |
| Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces D Straubinger, I Bozsóki, B Illes, O Krammer, D Bušek, A Geczy Soldering & Surface Mount Technology 32 (4), 247-252, 2020 | 6 | 2020 |
| Simulation of reflow-based heat transfer on different thermocouple constructions D Straubinger, B Illés, R Berényi, A Géczy 2020 43rd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2020 | 4 | 2020 |
| Soldering with SACX0307-(TiO2/ZnO) nano-composite solder alloys B Illés, A Skwarek, O Krammer, D Straubinger, B Lakó, G Harsányi, ... 2021 44th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2021 | 3 | 2021 |
| Investigating current density in the lead free solder joints of surface mounted resistors with experimental approach A Géczy, D Straubinger, T Hurtony, O Krammer, A Kovács 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2017 | 3 | 2017 |
| Properties of nano-composite SACX0307-(ZnO, TiO2) solders B Illés, A Skwarek, O Krammer, T Hurtony, D Straubinger, J Ratajczak, ... 2021 23rd European Microelectronics and Packaging Conference & Exhibition …, 2021 | 2 | 2021 |
| Scaling of Components for Explicit Modelling of Heat Transfer during Vapour Phase Reflow Soldering D Straubinger, I Bozsóki, L Gál, A Géczy 2019 IEEE 25th International Symposium for Design and Technology in …, 2019 | 2 | 2019 |
| Investigating shadowing and possible tombstoning caused by large SMD components during vapour phase reflow soldering A Géczy, D Szalmási, D Straubinger, B Illés 2019 IEEE 25th International Symposium for Design and Technology in …, 2019 | 2 | 2019 |
| Analytical solution of heat distribution inside a printed circuit board during vapour phase soldering D Straubinger, I Bozsóki, B Illés, A Géczy 2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-5, 2019 | 2 | 2019 |
| Wetting of different lead free solder alloys during vapour phase soldering MA Alaya, L Gál, T Hurtony, B Medgyes, D Straubinger, AM Tareq, B Illés, ... 2019 42nd International Spring Seminar on Electronics Technology (ISSE), 1-6, 2019 | 1 | 2019 |
| Novel aspects of reflow soldering in electronics manufacturing D Straubinger | | 2023 |
| Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors D Straubinger, A Toth, V Kerek, Z Czeczei, A Szabo, A Geczy Soldering & Surface Mount Technology 34 (4), 203-211, 2022 | | 2022 |
| Flow and Gauge Sensor Fusion in Vapour Phase Soldering Ovens for Optimized Process Control A Géczy, MA Alaya, E Rozs, D Straubinger, B Illés 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 111-114, 2021 | | 2021 |
| Extending Insight About Solder Beading Effect Under Surface-mounted Electrolytic Capacitors D Straubinger, A Tóth 2021 IEEE 27th International Symposium for Design and Technology in …, 2021 | | 2021 |
