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- William L. JohnsonCalifornia Institute of TechnologyVerified email at caltech.edu
- Mary Laura LindProfessor, Arizona State UniversityVerified email at asu.edu
- Donghua XuAssociate Professor, Oregon State UniversityVerified email at oregonstate.edu
- Bai NieIntel CorporationVerified email at msu.edu
- Douglas HofmannNASA JPL/California Institute of TechnologyVerified email at jpl.nasa.gov
- Jin-Yoo Suh (서진유)Korea Institute of Science and TechnologyVerified email at kist.re.kr
- Tahir CaginProfessor of Materials Science and Engineering, Chemical Engineering, Texas A&M UniversityVerified email at tamu.edu
- William A Goddard IIIProfessor Chemistry, Materials Science, Applied PhysicsVerified email at caltech.edu
- Sameer R PaitalEngineer, Intel Corporation, Chandler, AZ, USAVerified email at intel.com
- Boonrat LohwongwatanaChulalongkorn UniversityVerified email at meticuly.com
- Deepak KulkarniSenior Fellow, Advanced Packaging, AMDVerified email at amd.com
- R. Alan MayApplied MaterialsVerified email at amat.com
- Leonel AranaIntel CorporationVerified email at alum.mit.edu
- Omkar KarhadeIntelVerified email at intel.com
- Joseph P. SchrammCalifornia Institute of TechnologyVerified email at caltech.edu
- Kemal AygunFellow, Assembly and Test Technology Development, Intel CorporationVerified email at intel.com
- Zhiguo QianIntelVerified email at intel.com
- Krishna BharathLightmatter IncVerified email at lightmatter.co
- Michael J HillIntelVerified email at intel.com
- Edvin CetegenPackaging EngineerVerified email at intel.com