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Co-authors
- philip phillipsuniversity of illinois at urbana champaignVerified email at illinois.edu
- Weicheng LvUniversity of Tennessee and Oak Ridge National Laboratory Verified email at utk.edu
- K.T. LawHong Kong University of Science and TechnologyVerified email at ust.hk
- James Jun HEUniversity of Science and Technology of ChinaVerified email at connect.ust.hk
- Antonio H. Castro NetoInstitute for Functional Intelligent Materials and Centre for Advanced 2D MaterialsVerified email at nus.edu.sg
- Hui JingHuNan Normal UniversityVerified email at physics.arizona.edu
- Frank KrugerUniversity College London (UCL)Verified email at ucl.ac.uk
- tang qiulinUniversity of UtahVerified email at tmriusa.com
- Kuei SunWashington State University Tri-CitiesVerified email at wsu.edu
- Hsiang-Hsuan HungDepartment of Physics, University of Texas at AustinVerified email at physics.utexas.edu
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Jiansheng Wu
Assistant Researcher at Southern University of Science and Technology
Verified email at sustech.edu.cn