| Vertical nanowire FET devices H Deligianni, Q Huang, LT Romankiw US Patent 8,637,849, 2014 | 178 | 2014 |
| Methods of manufacture of vertical nanowire FET devices H Deligianni, Q Huang, LT Romankiw US Patent 7,892,956, 2011 | 141 | 2011 |
| Controlling fragmentation of chemically strengthened glass C Cabral Jr, FE Doany, GM Fritz, MS Gordon, Q Huang, EP Lewandowski, ... US Patent 9,586,857, 2017 | 75 | 2017 |
| Microstructure modification in copper interconnect structure BC Baker-O'Neal, C Cabral Jr, Q Huang, KP Rodbell US Patent 7,843,063, 2010 | 69 | 2010 |
| Electrodeposition of SbTe phase-change alloys Q Huang, AJ Kellock, S Raoux Journal of The Electrochemical Society 155 (2), D104, 2007 | 65 | 2007 |
| Electrodeposition of indium on copper for CIS and CIGS solar cell applications Q Huang, K Reuter, S Amhed, L Deligianni, LT Romankiw, S Jaime, ... Journal of The Electrochemical Society 158 (2), D57, 2010 | 51 | 2010 |
| Leveler effect and oscillatory behavior during copper electroplating Q Huang, BC Baker-O’Neal, C Parks, M Hopstaken, A Fluegel, C Emnet, ... Journal of The Electrochemical Society 159 (9), D526, 2012 | 47 | 2012 |
| Electrodeposition of FeCoNiCu/Cu compositionally modulated multilayers Q Huang, DP Young, JY Chan, J Jiang, EJ Podlaha Journal of the Electrochemical Society 149 (6), C349, 2002 | 45 | 2002 |
| Microstructure modification in copper interconnect structures C Cabral Jr, JP Gambino, Q Huang, T Nogami, KP Rodbell US Patent 8,492,897, 2013 | 44 | 2013 |
| Electrodeposition of FeCoNiCu nanowires Q Huang, D Davis, EJ Podlaha Journal of applied electrochemistry 36, 871-882, 2006 | 44 | 2006 |
| Simulation of pulsed electrodeposition for giant magnetoresistance FeCoNiCu/Cu multilayers Q Huang, EJ Podlaha Journal of the Electrochemical Society 151 (2), C119, 2004 | 43 | 2004 |
| Electrodeposition of cobalt for interconnect application: effect of dimethylglyoxime Q Huang, TW Lyons, WD Sides Journal of The Electrochemical Society 163 (13), D715, 2016 | 40 | 2016 |
| Impurities in the electroplated sub-50 nm Cu lines: The effects of the plating additives Q Huang, A Avekians, S Ahmed, C Parks, B Baker-O'Neal, S Kitayaporn, ... Journal of The Electrochemical Society 161 (9), D388, 2014 | 40 | 2014 |
| Single-crystalline germanium thin films by electrodeposition and solid-phase epitaxy Q Huang, SW Bedell, KL Saenger, M Copel, H Deligianni, LT Romankiw Electrochemical and Solid State Letters 10 (11), D124, 2007 | 38 | 2007 |
| Formation of nanostructures comprising compositionally modulated ferromagnetic layers by pulsed ECD H Deligianni, Q Huang, LT Romankiw US Patent 7,736,753, 2010 | 37 | 2010 |
| Electrodeposition methods of gallium and gallium alloy films and related photovoltaic structures S Ahmed, H Deligianni, Q Huang, KB Reuter, LT Romankiw, ... US Patent App. 12/874,496, 2012 | 34 | 2012 |
| Electrodeposition of rhenium with suppressed hydrogen evolution from water-in-salt electrolyte Q Huang, TW Lyons Electrochemistry Communications 93, 53-56, 2018 | 31 | 2018 |
| Electrodeposition of manganese thin films on a rotating disk electrode from choline chloride/urea based ionic liquids WD Sides, Q Huang Electrochimica Acta 266, 185-192, 2018 | 30 | 2018 |
| Electrodeposition of gold on silicon nucleation and growth phenomena Q Huang, H Deligianni, LT Romankiw Journal of the Electrochemical Society 153 (5), C332, 2006 | 30 | 2006 |
| Suppressor effects during copper superfilling of sub-100 nm lines Q Huang, BC Baker-O’Neal, JJ Kelly, P Broekmann, A Wirth, C Emnet, ... Electrochemical and Solid State Letters 12 (4), D27, 2009 | 29 | 2009 |
Elizabeth J PodlahaChair and Professor of Chemical Engineering, Clarkson University, NYVerified email at clarkson.edu
