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Co-authors
- Jun ZhangHong Kong University of Science and Technology, IEEE FellowVerified email at ust.hk
- Jiawei ShaoHong Kong University of Science and TechnologyVerified email at connect.ust.hk
- Dongsheng LiMicrosoft Research AsiaVerified email at microsoft.com
- Khaled B. LetaiefMember of US National Academy of Engineering and New Bright Professor of Engineering, HKUSTVerified email at ust.hk
- Zehong LinHong Kong University of Science and TechnologyVerified email at ust.hk
- Hao PanResearcher, Microsoft Research AsiaVerified email at microsoft.com
- Xinglin ZhangProfessor, South China University of TechnologyVerified email at scut.edu.cn
- Yan WangTsinghua university; SenseTimeVerified email at air.tsinghua.edu.cn
- Tongda XuPhd candidate, Tsinghua UniversityVerified email at air.tsinghua.edu.cn
- Xingtong GeBeijing Institute of TechnologyVerified email at bit.edu.cn
- Yuyi MAOThe Hong Kong Polytechnic UniversityVerified email at connect.ust.hk
- Dailan HeThe Chinese University of Hong KongVerified email at link.cuhk.edu.hk
- Hongwei QinSenseTimeVerified email at sensetime.com
- Guo LuShanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
- Ren YangSenior Researcher at Microsoft, Doktor der Wissenschaften (Dr. sc. ETH Zürich)Verified email at microsoft.com
- Jixiang LuoSensetimeVerified email at sensetime.com
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Xinjie Zhang
PhD student, Hong Kong University of Science and Technology
Verified email at connect.ust.hk - Homepage