| High-frequency scalable electrical model and analysis of a through silicon via (TSV) J Kim, JS Pak, J Cho, E Song, J Cho, H Kim, T Song, J Lee, H Lee, K Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011 | 442 | 2011 |
| 3D-MAPS: 3D Massively Parallel Processor with Stacked Memory DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ... IEEE International Solid-State Circuits Conference, 188-190, 2012 | 211 | 2012 |
| Modeling and analysis of through-silicon via (TSV) noise coupling and suppression using a guard ring J Cho, E Song, K Yoon, JS Pak, J Kim, W Lee, T Song, K Kim, J Lee, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011 | 174 | 2011 |
| Low frequency electromagnetic field reduction techniques for the on-line electric vehicle (OLEV) S Ahn, J Pak, T Song, H Lee, JG Byun, D Kang, CS Choi, E Kim, J Ryu, ... 2010 IEEE International Symposium on Electromagnetic Compatibility, 625-630, 2010 | 143 | 2010 |
| PDN impedance modeling and analysis of 3D TSV IC by using proposed P/G TSV array model based on separated P/G TSV and chip-PDN models JS Pak, J Kim, J Cho, K Kim, T Song, S Ahn, J Lee, H Lee, K Park, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011 | 141 | 2011 |
| Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC C Liu, T Song, J Cho, J Kim, J Kim, SK Lim 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC), 783-788, 2011 | 115 | 2011 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer K Yoon, G Kim, W Lee, T Song, J Lee, H Lee, K Park, J Kim 2009 11th Electronics Packaging Technology Conference, 702-706, 2009 | 90 | 2009 |
| Design and analysis of 3D-MAPS (3D massively parallel processor with stacked memory) DH Kim, K Athikulwongse, MB Healy, MM Hossain, M Jung, I Khorosh, ... IEEE Transactions on Computers 64 (1), 112-125, 2013 | 76 | 2013 |
| Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs T Song, C Liu, Y Peng, SK Lim Proceedings of the 50th Annual Design Automation Conference, 1-7, 2013 | 46 | 2013 |
| Silicon effect-aware full-chip extraction and mitigation of TSV-to-TSV coupling Y Peng, T Song, D Petranovic, SK Lim IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2014 | 41 | 2014 |
| Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs T Song, C Liu, DH Kim, SK Lim, J Cho, J Kim, JS Pak, S Ahn, J Kim, ... 2011 12th International Symposium on Quality Electronic Design, 1-7, 2011 | 36 | 2011 |
| On enhancing power benefits in 3D ICs: Block folding and bonding styles perspective M Jung, T Song, Y Wan, Y Peng, SK Lim 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC), 1-6, 2014 | 34 | 2014 |
| On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs Y Peng, T Song, D Petranovic, SK Lim 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 281-288, 2013 | 25 | 2013 |
| How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core M Jung, T Song, Y Wan, YJ Lee, D Mohapatra, H Wang, G Taylor, ... Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, 1-4, 2013 | 25 | 2013 |
| Full-chip signal integrity analysis and optimization of 3-D ICs T Song, C Liu, Y Peng, SK Lim IEEE Transactions on Very Large Scale Integration (VLSI) Systems 24 (5 …, 2015 | 23 | 2015 |
| Through silicon via (TSV) shielding structures J Cho, J Kim, T Song, JS Pak, J Kim, H Lee, J Lee, K Park 19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010 | 22 | 2010 |
| Signal integrity analysis and optimization for 3D ICs C Liu, T Song, SK Lim 2011 12th International Symposium on Quality Electronic Design, 1-8, 2011 | 21 | 2011 |
| I/O power estimation and analysis of high-speed channels in through-silicon via (TSV)-based 3D IC J Kim, J Cho, JS Pak, T Song, J Kim, H Lee, J Lee, K Park 19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010 | 21 | 2010 |
| Analysis of power distribution network in TSV-based 3D-IC K Kim, W Lee, J Kim, T Song, J Kim, JS Pak, J Kim, H Lee, Y Kwon, K Park 19th Topical Meeting on Electrical Performance of Electronic Packaging and …, 2010 | 19 | 2010 |
| Design methodologies for low-power 3-D ICs with advanced tier partitioning M Jung, T Song, Y Peng, SK Lim IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (7 …, 2017 | 14 | 2017 |
