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Co-authors
- Khan Rabbi, Ph.D.Packaging R&D Engineer (Thermal Fluids) at Intel CorporationVerified email at intel.com
- Mohsen SheikholeslamiMechanical Engineering in Babol Noshirvani University of tehcnologyVerified email at nit.ac.ir
- Sukwon ChoiAssociate Professor of Mechanical Engineering, The Pennsylvania State UniversityVerified email at psu.edu
- Daniel C. ShoemakerThe Pennsylvania State UniversityVerified email at psu.edu
- Yiwen SongDepartment of Mechanical Engineering, The Pennsylvania State UniversityVerified email at psu.edu
- Jong-Hoon KimWashington State University VancouverVerified email at wsu.edu
- Joon Seop KwakKorea Institute of Energy Technology/Sunchon National UniversityVerified email at kentech.ac.kr