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- Katia BertoldiSEAS, Harvard UniversityEmail verificata su seas.harvard.edu
- Sung Hoon KangJohns Hopkins University, Harvard University, MITEmail verificata su jhu.edu
- Pai WangUniversity of Utah; Harvard UniversityEmail verificata su utah.edu
- James C. WeaverWyss Institute, Harvard UniversityEmail verificata su wyss.harvard.edu
- Jennifer A. LewisHarvard UniversityEmail verificata su seas.harvard.edu
- Jordan R. RaneyUniversity of PennsylvaniaEmail verificata su seas.upenn.edu
- Lichen FangApple Inc.Email verificata su jhu.edu
- Jongmin ShimUniversity at BuffaloEmail verificata su buffalo.edu
- Andrej KošmrljAssociate Professor of Mechanical and Aerospace Engineering, Princeton UniversityEmail verificata su princeton.edu
- Samuel ShianResearch Associate in Materials Science and Mechanical Engineering, Harvard UniversityEmail verificata su seas.harvard.edu
- Johannes T. B. OverveldeAssociate Professor, AMOLF & Eindhoven University of TechnologyEmail verificata su amolf.nl
- Joanna AizenbergHarvard UniversityEmail verificata su seas.harvard.edu
- Jia LiuMedtronic PlcEmail verificata su medtronic.com
- Cangyu Qu (瞿苍宇)Postdoc, University of Pennsylvania; PhD, Tsinghua UniversityEmail verificata su seas.upenn.edu
- David R. ClarkeProfessor of Materials and Applied Physics, Harvard UniversityEmail verificata su seas.harvard.edu
- Tianyu GuNYU ECEEmail verificata su nyu.edu
- Xi-Qiao Feng (冯西桥)Professor of Solid Mechanics and Biomechanics, Tsinghua UniversityEmail verificata su tsinghua.edu.cn
- Li BingweiTsinghua UniversityEmail verificata su manchester.ac.uk
- Sahab BabaeeMassachusetts Institute of TechnologyEmail verificata su mit.edu
- Filippo CasadeiGaTech
Segui
Dr. Sicong Shan
School of Engineering and Applied Sciences (SEAS), Harvard University
Email verificata su seas.harvard.edu