| Theoretical analysis of electromigration-induced failure of metallic thin films due to transgranular void propagation MR Gungor, D Maroudas Journal of Applied Physics 85 (4), 2233-2246, 1999 | 136 | 1999 |
| Electromigration-induced failure of metallic thin films due to transgranular void propagation MR Gungor, D Maroudas Applied Physics Letters 72 (26), 3452-3454, 1998 | 76 | 1998 |
| Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections MR Gungor, D Maroudas International Journal of Fracture 109, 47-68, 2001 | 65 | 2001 |
| Effects of mechanical stress on electromigration-driven transgranular void dynamics in passivated metallic thin films MR Gungor, D Maroudas, LJ Gray Applied Physics Letters 73 (26), 3848-3850, 1998 | 48 | 1998 |
| Current-induced stabilization of surface morphology in stressed solids V Tomar, MR Gungor, D Maroudas Physical review letters 100 (3), 036106, 2008 | 46 | 2008 |
| Non-linear analysis of the morphological evolution of void surfaces in metallic thin films under surface electromigration conditions MR Gungor, D Maroudas Surface science 415 (3), L1055-L1060, 1998 | 41 | 1998 |
| Electromigration-driven motion of morphologically stable voids in metallic thin films: Universal scaling of migration speed with void size J Cho, MR Gungor, D Maroudas Applied physics letters 85 (12), 2214-2216, 2004 | 37 | 2004 |
| Current-induced non-linear dynamics of voids in metallic thin films: morphological transition and surface wave propagation MR Gungor, D Maroudas Surface science 461 (1-3), L550-L556, 2000 | 35 | 2000 |
| Molecular-dynamics simulations of stacking-fault-induced dislocation annihilation in prestrained ultrathin single-crystalline copper films K Kolluri, MR Gungor, D Maroudas Journal of Applied Physics 105 (9), 2009 | 31 | 2009 |
| Molecular-dynamics study of the mechanism and kinetics of void growth in ductile metallic thin films MR Gungor, D Maroudas, S Zhou Applied Physics Letters 77 (3), 343-345, 2000 | 28 | 2000 |
| Current-driven interactions between voids in metallic interconnect lines and their effects on line electrical resistance J Cho, M Rauf Gungor, D Maroudas Applied physics letters 88 (22), 2006 | 27 | 2006 |
| Atomistic mechanisms of strain relaxation due to ductile void growth in ultrathin films of face-centered-cubic metals MR Gungor, D Maroudas Journal of applied physics 97 (11), 2005 | 26 | 2005 |
| Molecular dynamics simulations of martensitic fcc-to-hcp phase transformations in strained ultrathin metallic films K Kolluri, MR Gungor, D Maroudas Physical Review B 78 (19), 195408, 2008 | 25 | 2008 |
| Effects of electromigration-induced void dynamics on the evolution of electrical resistance in metallic interconnect lines J Cho, MR Gungor, D Maroudas Applied Physics Letters 86 (24), 2005 | 25 | 2005 |
| Theoretical analysis of texture effects on the surface morphological stability of metallic thin films V Tomar, MR Gungor, D Maroudas Applied Physics Letters 92 (18), 2008 | 24 | 2008 |
| Atomic-scale analysis of defect dynamics and strain relaxation mechanisms in biaxially strained ultrathin films of face-centered cubic metals K Kolluri, MR Gungor, D Maroudas Journal of Applied Physics 103 (12), 2008 | 23 | 2008 |
| Electromigration-induced wave propagation on surfaces of voids in metallic thin films: Hopf bifurcation for high grain symmetry J Cho, MR Gungor, D Maroudas Surface science 575 (1-2), L41-L50, 2005 | 22 | 2005 |
| Continuum and atomistic modeling of electromechanically-induced failure of ductile metallic thin films D Maroudas, MR Gungor Computational materials science 23 (1-4), 242-249, 2002 | 22 | 2002 |
| Stress-induced deceleration of electromigration-driven void motion in metallic thin films MR Gungor, D Maroudas Journal of Applied Physics 101 (6), 2007 | 21 | 2007 |
| Nonhydrostatic stress effects on failure of passivated metallic thin films due to void surface electromigration MR Gungor, D Maroudas Surface science 432 (3), L604-L610, 1999 | 19 | 1999 |
