| Impact crack propagation through the dual-phased (Cu, Ni) 6Sn5 layer in Sn–Ag–Cu/Ni solder joints SW Fu, CY Yu, TK Lee, KC Liu, JG Duh Materials letters 80, 103-105, 2012 | 30 | 2012 |
| A study on intermetallic compound formation in Ag–Al system and evaluation of its mechanical properties by micro-indentation SW Fu, CC Lee Journal of Materials Science: Materials in Electronics 29, 3985-3991, 2018 | 29 | 2018 |
| A corrosion study of Ag–Al intermetallic compounds in chlorine-containing epoxy molding compounds SW Fu, CC Lee Journal of Materials Science: Materials in Electronics 28, 15739-15747, 2017 | 27 | 2017 |
| A reaction study of sulfur vapor with silver and silver–indium solid solution as a tarnishing test method Y Huo, SW Fu, YL Chen, CC Lee Journal of Materials Science: Materials in Electronics 27, 10382-10392, 2016 | 25 | 2016 |
| Direct silver to aluminum solid-state bonding processes SW Fu, CC Lee Materials Science and Engineering: A 722, 160-166, 2018 | 21 | 2018 |
| Solid-state reactions of silver and aluminum associated with silver wire bonds SW Fu, CC Lee 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 648-653, 2016 | 12 | 2016 |
| Exchange interaction mediated ferroelectricity in multiferroic MnTiO3 with anisotropic orbital hybridization and hole delocalization SW Chen, PA Lin, HT Jeng, SW Fu, JM Lee, JF Lee, CW Pao, H Ishii, ... Applied Physics Letters 104 (8), 2014 | 11 | 2014 |
| Low temperature structural anomalies arising from competing exchange interactions in pyrochlore Nd 2 Ru 2 O 7 probed by XRD and EXAFS SW Chen, SW Fu, CW Pao, JM Lee, SA Chen, SC Haw, JF Lee, CH Liu, ... Physical Chemistry Chemical Physics 17 (36), 23667-23673, 2015 | 10 | 2015 |
| New solid-state die-attach method using silver foil bonded on aluminum substrate by eutectic reaction SW Fu, CC Lee Journal of Alloys and Compounds 774, 1207-1215, 2019 | 7 | 2019 |
| Direct bonding silver to aluminum using eutectic reaction in air SW Fu, CC Lee 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 545-550, 2018 | 3 | 2018 |
| Silver aluminum solid-state and eutectic bonding processes and study of intermetallic properties and corrosion for advanced electronics and photonics SW Fu University of California, Irvine, 2018 | 1 | 2018 |
| A reaction study of sulfur vapors with pure silver and silver-indium solid solutions as a new anti-tarnishing test method SW Fu UC Irvine, 2016 | 1 | 2016 |
| A reaction study of sulfur vapors with pure silver and silver-indium solid solutions as a new SW Fu | | 2016 |
