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Co-authors
- X. Wendy GuAssistant Professor, Department of Mechanical Engineering, Stanford UniversityVerified email at stanford.edu
- ZHANG Yong-WeiInstitute of High Performance Computing, Agency for Science, Technology and Research.Verified email at ihpc.a-star.edu.sg
- Robert MaassFederal Institute of Materials Research and Testing & University of Illinois at Urbana-ChampaignVerified email at bam.de
- Shelby B. HutchensAssociate Professor - University of Illinois Urbana-ChampaignVerified email at illinois.edu
- William Bernard CarterDirector, Sensors and Materials Laboratory, HRL Laboratories, LLCVerified email at hrl.com
- David J. SrolovitzDept of Mechanical Eng., The University of Hong KongVerified email at hku.hk
- Huajian GaoXinghua University Professor, Tsinghua UniversityVerified email at tsinghua.edu.cn
- A. NeedlemanMaterials Science and Engineering, Texas A&M UniversityVerified email at tamu.edu
- Sammy TinUniversity of ArizonaVerified email at arizona.edu