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Co-authors
Hongjun YangUSAAVerified email at usaa.com- Jung-Hun Seo (서정훈)Assistant Professor of Materials Design & Innovation, University at BuffaloVerified email at buffalo.edu
- Deyin ZhaoUniversity of Texas at Arlington; Semerane Inc.Verified email at uta.edu
- Mattias HammarKTH - Royal Institute of TechnologyVerified email at KTH.se
- Yi-Chen ShuaiNational Institute of Standards and TechnologyVerified email at nist.gov
- Shanhui FanProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Richard A. SorefResearch Professor of Engineering, The University of Massachusetts at BostonVerified email at rcn.com
- Sang June ChoElectrical Engineering at UW-MadisonVerified email at wisc.edu
- Munho KimAssistant Professor of EEE at Nanyang Technological UniversityVerified email at ntu.edu.sg
- omar qasaimehProfVerified email at just.edu.jo
- Arvinder ChadhaUniversity of Texas at ArlingtonVerified email at mavs.uta.edu
- Shaoqin Sarah GongProfessor, University of Wisconsin-Madison, Dept. of Biomedical Engineering and WIDVerified email at engr.wisc.edu
- Peichen YuDepartment of Photonics, National Chiao Tung UniversityVerified email at faculty.nctu.edu.tw
- George K CellerProfessor of Materials Science, Rutgers UniversityVerified email at rci.rutgers.edu
- Sanjay KrishnaProfessor and George R Smith Chair of Engineering, ECE Department, Ohio State UniversityVerified email at osu.edu
- Lei Sun 孙磊Detection Technology Inc./ Princeton University/University of Wisconsin Madison/ Tsinghua UniversityVerified email at cn.deetee.com
- Gail J BrownAir Force Research LaboratoryVerified email at us.af.mil
- Jamie PhillipsArthur F. Thurnau Professor, Electrical Engineering and Computer Science, University of MichiganVerified email at umich.edu
- Juejun HuMITVerified email at mit.edu
- David J klotzkinBinghamton UniversityVerified email at binghamton.edu
