Fabian Könemann
Fabian Könemann
IBM Research Zurich
Verified email at zurich.ibm.com - Homepage
Title
Cited by
Cited by
Year
A survey of carbon nanotube interconnects for energy efficient integrated circuits
A Todri-Sanial, R Ramos, H Okuno, J Dijon, A Dhavamani, M Widlicenus, ...
IEEE Circuits and Systems Magazine 17 (2), 47-62, 2017
222017
A physics-based investigation of pt-salt doped carbon nanotubes for local interconnects
J Liang, R Ramos, J Dijon, H Okuno, D Kalita, D Renaud, J Lee, ...
2017 IEEE International Electron Devices Meeting (IEDM), 35.5. 1-35.5. 4, 2017
92017
Investigation of Pt-salt-doped-standalone-multiwall carbon nanotubes for on-chip interconnect applications
J Liang, R Chen, R Ramos, J Lee, H Okuno, D Kalita, V Georgiev, ...
IEEE Transactions on Electron Devices 66 (5), 2346-2352, 2019
82019
Crossover from ballistic to diffusive thermal transport in suspended graphene membranes
A El Sachat, F Könemann, F Menges, E Del Corro, JA Garrido, ...
2D Materials, 2019
82019
Local thermometry of self-heated nanoscale devices
F Menges, F Könemann (né Motzfeld), H Schmid, P Mensch, M Dittberner, ...
2016 IEEE International Electron Devices Meeting (IEDM), 15.8. 1-15.8. 4, 2016
82016
Progress on carbon nanotube BEOL interconnects
B Uhlig, J Liang, J Lee, R Ramos, A Dhavamani, N Nagy, J Dijon, ...
2018 Design, Automation & Test in Europe Conference & Exhibition (DATE), 937-942, 2018
72018
Thermal Conductivity of a Supported Multiwalled Carbon Nanotube
F Könemann, M Vollmann, T Wagner, N Mohd Ghazali, T Yamaguchi, ...
The Journal of Physical Chemistry C 123 (19), 12460-12465, 2019
62019
Imaging the thermalization of hot carriers after thermionic emission over a polytype barrier
F Könemann, IJ Chen, S Lehmann, C Thelander, B Gotsmann
Physical Review Applied 13 (5), 054035, 2020
42020
Nanoscale Scanning Probe Thermometry
F Könemann, M Vollmann, F Menges, IJ Chen, NM Ghazali, T Yamaguchi, ...
2018 24rd International Workshop on Thermal Investigations of ICs and …, 2018
42018
Single‐Material Graphene Thermocouples
A Harzheim, F Könemann, B Gotsmann, H van der Zant, P Gehring
Advanced Functional Materials 30 (22), 2000574, 2020
32020
Challenges and progress on carbon nanotube integration for beol interconnects
B Uhlig, A Dhavamani, N Nagy, K Lilienthal, R Liske, R Ramos, J Dijon, ...
2018 IEEE International Interconnect Technology Conference (IITC), 16-18, 2018
32018
Spatially resolved thermoelectric effects in operando semiconductor–metal nanowire heterostructures
N Gächter, F Könemann, M Sistani, MG Bartmann, M Sousa, P Staudinger, ...
Nanoscale 12 (40), 20590-20597, 2020
12020
Method for fabricating a semiconductor device
S Mauthe, M Sousa, F Konemann, KE Moselund
US Patent App. 16/375,255, 2020
2020
Scanning Probe Thermometry to study Thermoelectricity and Dissipation at Nanoscale Junctions
F Könemann
ETH Zurich, 2019
2019
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Articles 1–14