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Thomas Brunschwiler
Thomas Brunschwiler
IBM Research
Verified email at zurich.ibm.com
Title
Cited by
Cited by
Year
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza
2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 463-470, 2010
3882010
Forced convective interlayer cooling in vertically integrated packages
T Brunschwiler, B Michel, H Rothuizen, U Kloter, B Wunderle, ...
2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008
3342008
Energy efficient hotspot-targeted embedded liquid cooling of electronics
CS Sharma, MK Tiwari, S Zimmermann, T Brunschwiler, G Schlottig, ...
Applied Energy 138, 414-422, 2015
2032015
Interlayer cooling potential in vertically integrated packages
T Brunschwiler, B Michel, H Rothuizen, U Kloter, B Wunderle, ...
Microsystem Technologies 15, 57-74, 2009
2002009
Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips
W Escher, T Brunschwiler, B Michel, D Poulikakos
1902010
Direct liquid jet-impingment cooling with micron-sized nozzle array and distributed return architecture
T Brunschwiler, H Rothuizen, M Fabbri, U Kloter, B Michel, RJ Bezama, ...
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
1812006
On the cooling of electronics with nanofluids
W Escher, T Brunschwiler, N Shalkevich, A Shalkevich, T Burgi, B Michel, ...
1412011
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
AK Coskun, D Atienza, TS Rosing, T Brunschwiler, B Michel
2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010 …, 2010
1382010
3D-ICE: A compact thermal model for early-stage design of liquid-cooled ICs
A Sridhar, A Vincenzi, D Atienza, T Brunschwiler
IEEE Transactions on Computers 63 (10), 2576-2589, 2013
1362013
Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate
PS Andry, TJ Brunschwiler, EG Colgan, JH Magerlein
US Patent 7,990,711, 2011
1302011
Cloud computing
D Bryan, M Anderson
A weapon of mass destruction, 2010
1252010
Toward zero-emission data centers through direct reuse of thermal energy
T Brunschwiler, B Smith, E Ruetsche, B Michel
IBM Journal of Research and Development 53 (3), 11: 1-11: 13, 2009
1232009
A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
CS Sharma, G Schlottig, T Brunschwiler, MK Tiwari, B Michel, ...
International Journal of Heat and Mass Transfer 88, 684-694, 2015
1142015
Hysteretic electroluminescence in organic light-emitting diodes for spin injection
G Salis, SF Alvarado, M Tschudy, T Brunschwiler, R Allenspach
Physical Review B 70 (8), 085203, 2004
1032004
Toward five-dimensional scaling: How density improves efficiency in future computers
P Ruch, T Brunschwiler, W Escher, S Paredes, B Michel
IBM Journal of Research and Development 55 (5), 15: 1-15: 13, 2011
912011
3D integrated water cooling of a composite multilayer stack of chips
F Alfieri, MK Tiwari, I Zinovik, D Poulikakos, T Brunschwiler, B Michel
812010
Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries
A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza
2010 16th International workshop on thermal investigations of ICs and …, 2010
812010
Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
A Renfer, MK Tiwari, R Tiwari, F Alfieri, T Brunschwiler, B Michel, ...
International Journal of Heat and Mass Transfer 65, 33-43, 2013
802013
Energy-efficient multiobjective thermal control for liquid-cooled 3-D stacked architectures
MM Sabry, AK Coskun, D Atienza, TŠ Rosing, T Brunschwiler
IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2011
802011
Semiconductor device with a high thermal dissipation efficiency
TJ Brunschwiler, M Despont, MA Lantz, B Michel, P Vettiger
US Patent 7,928,565, 2011
682011
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