Hsin Wang
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Multiple-filled skutterudites: high thermoelectric figure of merit through separately optimizing electrical and thermal transports
X Shi, J Yang, JR Salvador, M Chi, JY Cho, H Wang, S Bai, J Yang, ...
Journal of the American Chemical Society 133 (20), 7837-7846, 2011
Low thermal conductivity and high thermoelectric figure of merit in -type double-filled skutterudites
X Shi, H Kong, CP Li, C Uher, J Yang, JR Salvador, H Wang, L Chen, ...
Applied Physics Letters 92 (18), 182101, 2008
Thermal properties of Ti3SiC2
MW Barsoum, T El-Raghy, CJ Rawn, WD Porter, H Wang, EA Payzant, ...
Journal of Physics and Chemistry of Solids 60 (4), 429-439, 1999
Thermal properties of lithium‐ion battery and components
H Maleki, S Al Hallaj, JR Selman, RB Dinwiddie, H Wang
Journal of the Electrochemical Society 146 (3), 947, 1999
The effect of grain size, porosity and yttria content on the thermal conductivity of nanocrystalline zirconia
S Raghavan, MJ Mayo, H Wang, RB Dinwiddie, WD Porter
Scripta Materialia 39 (8), 1119-1125, 1998
Thermophysical Properties of ZrB2 and ZrB2–SiC Ceramics
JW Zimmermann, GE Hilmas, WG Fahrenholtz, RB Dinwiddie, WD Porter, ...
Journal of the American Ceramic Society 91 (5), 1405-1411, 2008
On the design of high‐efficiency thermoelectric clathrates through a systematic cross‐substitution of framework elements
X Shi, J Yang, S Bai, J Yang, H Wang, M Chi, JR Salvador, W Zhang, ...
Advanced Functional Materials 20 (5), 755-763, 2010
Carbon‐nanotube‐reinforced polymer‐derived ceramic composites
L An, W Xu, S Rajagopalan, C Wang, H Wang, Y Fan, L Zhang, D Jiang, ...
Advanced Materials 16 (22), 2036-2040, 2004
Column formation in suspension plasma-sprayed coatings and resultant thermal properties
K VanEvery, MJM Krane, RW Trice, H Wang, W Porter, M Besser, ...
Journal of thermal spray technology 20 (4), 817-828, 2011
Ultrastrong, stiff and multifunctional carbon nanotube composites
X Wang, ZZ Yong, QW Li, PD Bradford, W Liu, DS Tucker, W Cai, H Wang, ...
Materials Research Letters 1 (1), 19-25, 2013
Fast and highly anisotropic thermal transport through vertically aligned carbon nanotube arrays
I Ivanov, A Puretzky, G Eres, H Wang, Z Pan, H Cui, R Jin, J Howe, ...
Applied Physics Letters 89 (22), 223110, 2006
Thermal properties of zirconia co-doped with trivalent and pentavalent oxides
S Raghavan, H Wang, WD Porter, RB Dinwiddie, MJ Mayo
Acta materialia 49 (1), 169-179, 2001
Phase stability, sintering, and thermal conductivity of plasma-sprayed ZrO2–Gd2O3 compositions for potential thermal barrier coating applications
MN Rahaman, JR Gross, RE Dutton, H Wang
Acta Materialia 54 (6), 1615-1621, 2006
Thermal and electrical properties of Nb2AlC, (Ti, Nb)2AlC and Ti2AlC
MW Barsoum, I Salama, T El-Raghy, J Golczewski, HJ Seifert, F Aldinger, ...
Metallurgical and Materials Transactions A 33 (9), 2775-2779, 2002
Effect of heat treatment on phase stability, microstructure, and thermal conductivity of plasma-sprayed YSZ
RW Trice, YJ Su, JR Mawdsley, KT Faber, AR De Arellano-Lopez, ...
Journal of materials science 37 (11), 2359-2365, 2002
Thermographic detection of fatigue damage of pressure vessel steels at 1,000 Hz and 20 Hz
PK Liaw, H Wang, L Jiang, B Yang, JY Huang, RC Kuo, JG Huang
Scripta Materialia 42 (4), 2000
Microstructure–Thermal Conductivity Relationships for Plasma‐Sprayed Yttria‐Stabilized Zirconia Coatings
W Chi, S Sampath, H Wang
Journal of the American Ceramic Society 91 (8), 2636-2645, 2008
Thermographic investigation of the fatigue behavior of reactor pressure vessel steels
B Yang, PK Liaw, H Wang, L Jiang, JY Huang, RC Kuo, JG Huang
Materials Science and Engineering: A 314 (1-2), 131-139, 2001
Experimental simulation of internal short circuit in Li-ion and Li-ion-polymer cells
W Cai, H Wang, H Maleki, J Howard, E Lara-Curzio
Journal of Power Sources 196 (18), 7779-7783, 2011
Transport properties of bulk thermoelectrics: an international round-robin study, part II: thermal diffusivity, specific heat, and thermal conductivity
H Wang, WD Porter, H Böttner, J König, L Chen, S Bai, TM Tritt, A Mayolet, ...
Journal of electronic materials 42 (6), 1073-1084, 2013
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