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Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp- Cory R. DeanColumbia UnviersityVerified email at phys.columbia.edu
- Philip KimHarvard UniversityVerified email at g.harvard.edu
- Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordVerified email at stanford.edu
- T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
- Lei WangColumbia UniversityVerified email at columbia.edu
- Kenneth ShepardLau Family Professor of Electrical Engineering and Professor of Biomedical Engineering, ColumbiaVerified email at ee.columbia.edu
- Gwan-Hyoung LeeAssociate Professor, Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
- Arend van der ZandeDepartment of Mechanical Science and Engineering, University of Illinois at Urbana ChampaignVerified email at illinois.edu
- Nicholas PetroneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
- Yuanda GaoIntel Corporation, Columbia UniversityVerified email at columbia.edu
- Kin Fai MakCornell UniversityVerified email at cornell.edu
- Daniel RhodesUniversity of Wisconsin - MadisonVerified email at wisc.edu
- Young Duck KimAssociate Professor, Department of Physics, Kyung Hee University, Seoul 02447, Republic of KoreaVerified email at khu.ac.kr
- Jie ShanCornell UniversityVerified email at cornell.edu
- Louis BrusProfessor of Chemistry, Columbia UniversityVerified email at columbia.edu
- Abhay PasupathyProfessor of Physics, Columbia UniversityVerified email at columbia.edu
- Inanc MericIntel Co.Verified email at intel.com
- dmitri basovColumbia UniversityVerified email at columbia.edu
- Jeffrey W. KysarProfessor of Mechanical Engineering and of Otolaryngology—Head & Neck Surgery, Columbia UniversityVerified email at columbia.edu
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James C. Hone
Department of Mechanical Engineering, Columbia University
Verified email at columbia.edu - Homepage