| The influences of temperature and microstructure on the tensile properties of a CoCrFeMnNi high-entropy alloy F Otto, A Dlouhý, C Somsen, H Bei, G Eggeler, EP George Acta Materialia 61 (15), 5743-5755, 2013 | 1385 | 2013 |
| Relative effects of enthalpy and entropy on the phase stability of equiatomic high-entropy alloys F Otto, Y Yang, H Bei, EP George Acta Materialia 61 (7), 2628-2638, 2013 | 771 | 2013 |
| Temperature dependence of the mechanical properties of equiatomic solid solution alloys with face-centered cubic crystal structures Z Wu, H Bei, GM Pharr, EP George Acta Materialia 81, 428-441, 2014 | 676 | 2014 |
| Exceptional damage-tolerance of a medium-entropy alloy CrCoNi at cryogenic temperatures B Gludovatz, A Hohenwarter, KVS Thurston, H Bei, Z Wu, EP George, ... Nature communications 7 (1), 1-8, 2016 | 527 | 2016 |
| Recovery, recrystallization, grain growth and phase stability of a family of FCC-structured multi-component equiatomic solid solution alloys Z Wu, H Bei, F Otto, GM Pharr, EP George Intermetallics 46, 131-140, 2014 | 457 | 2014 |
| Softening caused by profuse shear banding in a bulk metallic glass H Bei, S Xie, EP George Physical review letters 96 (10), 105503, 2006 | 394 | 2006 |
| Compressive strengths of molybdenum alloy micro-pillars prepared using a new technique H Bei, S Shim, EP George, MK Miller, EG Herbert, GM Pharr Scripta Materialia 57 (5), 397-400, 2007 | 334 | 2007 |
| Effects of pre-strain on the compressive stress–strain response of Mo-alloy single-crystal micropillars H Bei, S Shim, GM Pharr, EP George Acta Materialia 56 (17), 4762-4770, 2008 | 330 | 2008 |
| Influence of chemical disorder on energy dissipation and defect evolution in concentrated solid solution alloys Y Zhang, GM Stocks, K Jin, C Lu, H Bei, BC Sales, L Wang, LK Béland, ... Nature communications 6 (1), 1-9, 2015 | 301 | 2015 |
| Enhancing radiation tolerance by controlling defect mobility and migration pathways in multicomponent single-phase alloys C Lu, L Niu, N Chen, K Jin, T Yang, P Xiu, Y Zhang, F Gao, H Bei, S Shi, ... Nature communications 7 (1), 1-8, 2016 | 280 | 2016 |
| Microstructures and mechanical properties of a directionally solidified NiAl–Mo eutectic alloy H Bei, EP George Acta Materialia 53 (1), 69-77, 2005 | 261 | 2005 |
| Microstructural stability and mechanical behavior of FeNiMnCr high entropy alloy under ion irradiation NAPK Kumar, C Li, KJ Leonard, H Bei, SJ Zinkle Acta Materialia 113, 230-244, 2016 | 227 | 2016 |
| Effects of focused ion beam milling on the compressive behavior of directionally solidified micropillars and the nanoindentation response of an electropolished surface S Shim, H Bei, MK Miller, GM Pharr, EP George Acta Materialia 57 (2), 503-510, 2009 | 227 | 2009 |
| Mechanism of radiation damage reduction in equiatomic multicomponent single phase alloys F Granberg, K Nordlund, MW Ullah, K Jin, C Lu, H Bei, LM Wang, ... Physical review letters 116 (13), 135504, 2016 | 223 | 2016 |
| Influence of indenter tip geometry on elastic deformation during nanoindentation H Bei, EP George, JL Hay, GM Pharr Physical review letters 95 (4), 045501, 2005 | 223 | 2005 |
| A different type of indentation size effect S Shim, H Bei, EP George, GM Pharr Scripta Materialia 59 (10), 1095-1098, 2008 | 216 | 2008 |
| Theoretical strength and the onset of plasticity in bulk metallic glasses investigated by nanoindentation with a spherical indenter H Bei, ZP Lu, EP George Physical review letters 93 (12), 125504, 2004 | 215 | 2004 |
| Tuning element distribution, structure and properties by composition in high-entropy alloys Q Ding, Y Zhang, X Chen, X Fu, D Chen, S Chen, L Gu, F Wei, H Bei, ... Nature 574 (7777), 223-227, 2019 | 205 | 2019 |
| Flow serration in a Zr-based bulk metallic glass in compression at low strain rates SX Song, H Bei, J Wadsworth, TG Nieh Intermetallics 16 (6), 813-818, 2008 | 192 | 2008 |
| Nano-twin mediated plasticity in carbon-containing FeNiCoCrMn high entropy alloys Z Wu, CM Parish, H Bei Journal of Alloys and Compounds 647, 815-822, 2015 | 189 | 2015 |
Ke JinProfessor at Beijing Institute of TechnologyVerified email at bit.edu.cn
