Christopher M. Gourlay
Christopher M. Gourlay
Department of Materials, Imperial College London
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Zitiert von
Zitiert von
Dilatant shear bands in solidifying metals
CM Gourlay, AK Dahle
Nature 445 (7123), 70-73, 2007
Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates
K Nogita, CM Gourlay, T Nishimura
Jom 61 (6), 45-51, 2009
Defect band characteristics in Mg-Al and Al-Si high-pressure die castings
CM Gourlay, HI Laukli, AK Dahle
Metallurgical and Materials Transactions A 38 (8), 1833-1844, 2007
Microstructure formation in AlSi4MgMn and AlMg5Si2Mn high-pressure die castings
S Otarawanna, CM Gourlay, HI Laukli, AK Dahle
Metallurgical and Materials Transactions A 40 (7), 1645-1659, 2009
Migration of crystals during the filling of semi-solid castings
HI Laukli, CM Gourlay, AK Dahle
Metallurgical and Materials Transactions A 36 (3), 805-818, 2005
Granular deformation mechanisms in semi-solid alloys
CM Gourlay, AK Dahle, T Nagira, N Nakatsuka, K Nogita, K Uesugi, ...
Acta Materialia 59 (12), 4933-4943, 2011
The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi
T Ventura, CM Gourlay, K Nogita, T Nishimura, M Rappaz, AK Dahle
Journal of Electronic Materials 37 (1), 32-39, 2008
Direct observation of deformation in semi-solid carbon steel
T Nagira, CM Gourlay, A Sugiyama, M Uesugi, Y Kanzawa, M Yoshiya, ...
Scripta Materialia 64 (12), 1129-1132, 2011
Revealing the micromechanisms behind semi-solid metal deformation with time-resolved X-ray tomography
KM Kareh, PD Lee, RC Atwood, T Connolley, CM Gourlay
Nature communications 5 (1), 1-7, 2014
Kinetics of the η–η′ transformation in Cu6Sn5
K Nogita, CM Gourlay, SD McDonald, YQ Wu, J Read, QF Gu
Scripta Materialia 65 (10), 922-925, 2011
The influence of Ni additions on the relative stability of and
U Schwingenschlögl, C Di Paola, K Nogita, CM Gourlay
Applied Physics Letters 96 (6), 061908, 2010
Effects of Si content on defect band formation in hypoeutectic Al–Si die castings
HI Laukli, CM Gourlay, AK Dahle, O Lohne
Materials Science and Engineering: A 413, 92-97, 2005
In situ investigation of unidirectional solidification in Sn–0.7 Cu and Sn–0.7 Cu–0.06 Ni
CM Gourlay, K Nogita, AK Dahle, Y Yamamoto, K Uesugi, T Nagira, ...
Acta Materialia 59 (10), 4043-4054, 2011
Shear mechanisms at 0–50% solid during equiaxed dendritic solidification of an AZ91 magnesium alloy
CM Gourlay, B Meylan, AK Dahle
Acta materialia 56 (14), 3403-3413, 2008
NiSn4 formation during the solidification of Sn–Ni alloys
SA Belyakov, CM Gourlay
Intermetallics 25, 48-59, 2012
Engineering the Mg–Mg2Ni eutectic transformation to produce improved hydrogen storage alloys
K Nogita, S Ockert, J Pierce, MC Greaves, CM Gourlay, AK Dahle
International Journal of Hydrogen Energy 34 (18), 7686-7691, 2009
Intermetallic formation and fluidity in Sn-rich Sn-Cu-Ni alloys
CM Gourlay, K Nogita, J Read, AK Dahle
Journal of electronic materials 39 (1), 56-69, 2010
The thickness of defect bands in high-pressure die castings
S Otarawanna, CM Gourlay, HI Laukli, AK Dahle
Materials Characterization 60 (12), 1432-1441, 2009
Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay
Acta Materialia 126, 540-551, 2017
Nucleation and growth of tin in Pb-free solder joints
CM Gourlay, SA Belyakov, ZL Ma, JW Xian
Jom 67 (10), 2383-2393, 2015
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