Sushil Bhavnani
Sushil Bhavnani
Professor of Mechanical Engineering, Auburn University
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Cited by
Cited by
Thermal challenges in next-generation electronic systems
SV Garimella, AS Fleischer, JY Murthy, A Keshavarzi, R Prasher, C Patel, ...
IEEE Transactions on Components and Packaging Technologies 31 (4), 801-815, 2008
Effect of surface geometry and orientation on laminar natural convection heat transfer from a vertical flat plate with transverse roughness elements
SH Bhavnani, AE Bergles
International Journal of Heat and Mass Transfer 33 (5), 965-981, 1990
Teamwork across disciplinary borders: A bridge between college and the work place
SH Bhavnani, MD Aldridge
Journal of Engineering Education 89 (1), 13-16, 2000
Effect of nucleation site spacing on the pool boiling characteristics of a structured surface
ND Nimkar, SH Bhavnani, RC Jaeger
International journal of heat and mass transfer 49 (17-18), 2829-2839, 2006
Simulation of EPS foam decomposition in the lost foam casting process
XJ Liu, SH Bhavnani, RA Overfelt
Journal of Materials Processing Technology 182 (1-3), 333-342, 2007
Boiling augmentation with micro/nanostructured surfaces: current status and research outlook
S Bhavnani, V Narayanan, W Qu, M Jensen, S Kandlikar, J Kim, J Thome
Nanoscale and Microscale Thermophysical Engineering 18 (3), 197-222, 2014
Investigation into the application of low melting temperature alloys as wet thermal interface materials
CK Roy, S Bhavnani, MC Hamilton, RW Johnson, JL Nguyen, RW Knight, ...
International Journal of Heat and Mass Transfer 85, 996-1002, 2015
A multiscale model of thermal contact resistance between rough surfaces
RL Jackson, SH Bhavnani, TP Ferguson
Natural convection heat transfer from sinusoidal wavy surfaces
SH Bhavnani, AE Bergles
Wärme-und Stoffübertragung 26 (6), 341-349, 1991
Experimental study of torrefied pine as a gasification fuel using a bubbling fluidized bed gasifier
A Kulkarni, R Baker, N Abdoulmomine, S Adhikari, S Bhavnani
Renewable Energy 93, 460-468, 2016
Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages
NK Phadke, SH Bhavnani, A Goyal, RC Jaeger, JS Goodling
IEEE transactions on components, hybrids, and manufacturing technology 15 (5 …, 1992
Estimation of biomass synthesis gas composition using equilibrium modeling
G Gautam, S Adhikari, S Bhavnani
Energy & Fuels 24 (4), 2692-2698, 2010
A closed-form multiscale thermal contact resistance model
RL Jackson, H Ghaednia, YA Elkady, SH Bhavnani, RW Knight
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (7 …, 2012
An integral heat sink for cooling microelectronic components
SH Bhavnani, CP Tsai, RC Jaeger, DL Eison
Immersion-cooled heat sinks for electronics: insight from high-speed photography
SH Bhavnani, G Fournelle, RC Jaeger
IEEE Transactions on Components and Packaging Technologies 24 (2), 166-176, 2001
Thermal performance of low melting temperature alloys at the interface between dissimilar materials
CK Roy, S Bhavnani, MC Hamilton, RW Johnson, RW Knight, DK Harris
Applied Thermal Engineering 99, 72-79, 2016
Cavity-induced two-phase heat transfer in silicon microchannels
DT Pate, RJ Jones, SH Bhavnani
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006
Investigation of the performance of an expandable polystyrene injector for use in the lost-foam casting process
KF Wali, SH Bhavnani, RA Overfelt, DS Sheldon, K Williams
Metallurgical and Materials Transactions B 34 (6), 843-851, 2003
Effect of channel width on pool boiling from a microconfigured heat sink
RM Nowell, SH Bhavnani, RC Jaeger
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1995
Benchmark heat transfer data for microstructured surfaces for immersion-cooled microelectronics
ND Nimkar, SH Bhavnani, RC Jaeger
IEEE Transactions on Components and Packaging Technologies 29 (1), 89-97, 2006
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