| Nucleation and formation of zinc phosphate conversion coating on cold-rolled steel PE Tegehall, NG Vannerberg Corrosion science 32 (5-6), 635-652, 1991 | 80 | 1991 |
| The mechanism of chemical activation with titanium phosphate colloids in the formation of zinc phosphate conversion coatings PE Tegehall Colloids and surfaces 49, 373-383, 1990 | 58 | 1990 |
| Review of the impact of intermetallic layers on the brittleness of tin-lead and lead-free solder joints PE Tegehall IVF project report 6 (07), 1-63, 2006 | 47 | 2006 |
| Reliability of microtechnology: interconnects, devices and systems J Liu, O Salmela, J Sarkka, JE Morris, PE Tegehall, C Andersson Springer Science & Business Media, 2011 | 41 | 2011 |
| Colloidal titanium phosphate, the chemical activator in surface conditioning before zinc phosphating PE Tegehall Colloids and surfaces 42 (1), 155-164, 1989 | 41 | 1989 |
| Effect of PCB cracks on thermal cycling reliability of passive microelectronic components with single-grained solder joints S Akbari, A Lövberg, PE Tegehall, K Brinkfeldt, D Andersson Microelectronics Reliability 93, 61-71, 2019 | 34 | 2019 |
| Synthesis of Crystalline Titanium (IV) Phosphates by Direct Precipitation from Ti (Ill) Solutions and lon PE Tegehall Acta Chemica Scandinavica 40, 507-514, 1986 | 32 | 1986 |
| Thermal cycling aging effect on the shear strength, microstructure, intermetallic compounds (IMC) and crack initiation and propagation of reflow soldered Sn-3.8 Ag-0.7 Cu and … C Andersson, PE Tegehall, DR Andersson, G Wetter, J Liu IEEE Transactions on Components and Packaging Technologies 31 (2), 331-344, 2008 | 31 | 2008 |
| Reliability of BGA packages in an automotive environment R Rörgren, PE Tegehall, P Carlsson Journal of Surface Mount Technology 11, 35-44, 1998 | 29 | 1998 |
| Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components C Andersson, DR Andersson, PE Tegehall, J Liu 5th International Conference on Thermal and Mechanical Simulation and …, 2004 | 27 | 2004 |
| Impact of humidity and contamination on surface insulation resistance and electrochemical migration PE Tegehall The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues …, 2011 | 24 | 2011 |
| A surface study of the chemical pretreatment before coil coating of hot dip zinc‐coated steel SE Hörnström, EG Hedlund, H Klang, JO Nilsson, M Backlund, ... Surface and interface analysis 19 (1‐12), 121-126, 1992 | 21 | 1992 |
| Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components A Lövberg, PE Tegehall, G Wetter, K Brinkfeldt, D Andersson 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 18 | 2017 |
| Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints PE Tegehall, G Wetter Microelectronics Reliability 55 (11), 2354-2370, 2015 | 18 | 2015 |
| Ion exchange on a titanium phosphate and formation of new crystalline phases by hydrolysis of the ion-exchanged phases PE Tegehall Acta Chemica Scandinavica 43, 322-330, 1989 | 16 | 1989 |
| Thermal cycling of lead‐free Sn‐3.8 Ag‐0.7 Cu 388PBGA packages C Andersson, B Vandevelde, C Noritake, P Sun, PE Tegehall, ... Soldering & surface mount technology 21 (2), 28-38, 2009 | 14 | 2009 |
| The stress state of BGA solder joints influenced by the grain orientations of neighboring joints A Lövberg, PE Tegehall 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 882-889, 2018 | 13 | 2018 |
| On the formation and propagation of laminate cracks and their influence on the fatigue lives of solder joints A Lövberg, PE Tegehall, S Akbari, D Andersson 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 11 | 2018 |
| ENEPIG finish: An alternative solution for space printed circuit boards (PCB) A Chaillot, N Venet, PE Tegehall, J Hokka, JL Lortal 2013 Eurpoean Microelectronics Packaging Conference (EMPC), 1-6, 2013 | 10 | 2013 |
| Assessment of the Reliability of Solder Joints to Ball and Column Grid Array Packages for Space Applications PE Tegehall, BD Dunn ESA Publications Division, 2001 | 10 | 2001 |
