| Exceptional thermal interface properties of a three-dimensional graphene foam X Zhang, KK Yeung, Z Gao, J Li, H Sun, H Xu, K Zhang, M Zhang, Z Chen, ... Carbon 66, 201-209, 2014 | 112 | 2014 |
| Ultrastretchable conductive elastomers with a low percolation threshold for printed soft electronics H Sun, Z Han, N Willenbacher ACS applied materials & interfaces 11 (41), 38092-38102, 2019 | 32 | 2019 |
| Highly conductive polymer composites from room-temperature ionic liquid cured epoxy resin: effect of interphase layer on percolation conductance X Zhang, H Sun, C Yang, K Zhang, MMF Yuen, S Yang RSC advances 3 (6), 1916-1921, 2013 | 32 | 2013 |
| Enhanced conductivity induced by attractive capillary force in ternary conductive adhesive H Sun, X Zhang, MMF Yuen Composites Science and Technology 137, 109-117, 2016 | 18 | 2016 |
| Highly conductive die attach adhesive from percolation control and its applications in light-emitting device thermal management X Zhang, K Zhang, M Zhang, C Yang, H Sun, Z Gao, MMF Yuen, S Yang Applied Physics Letters 102 (1), 2013 | 10 | 2013 |
| FLECTILE: 3D-printable soft actuators for wearable computing L Fang, T Röddiger, H Sun, N Willenbacher, M Beigl Proceedings of the 2020 ACM International Symposium on Wearable Computers, 32-36, 2020 | 6 | 2020 |
| PDMSkin: On-Skin Gestures with Printable Ultra-Stretchable Soft Electronic Second Skin T Röddiger, M Beigl, D Wolffram, M Budde, H Sun Proceedings of the Augmented Humans International Conference, 1-9, 2020 | 5 | 2020 |
| Conductivity enhancement of thermal interface material via capillary attraction H Sun, MMF Yuen 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1409-1414, 2016 | 3 | 2016 |
| Highly conductive, printable ink for highly stretchable soft electronics H Sun, N Willenbacher, HAN Zongyou US Patent App. 17/276,863, 2022 | 1 | 2022 |
| Thermal improvement of die attach with iodine treatment and its application in solid state lighting K Zhang, X Zhang, M Zhang, C Yang, H Sun, M Yuen, B Zhong, AR Bok, ... 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 1 | 2012 |
| Highly conductive and stretchable filament for flexible electronics H Sun, J Zettl, N Willenbacher Additive Manufacturing 78, 103872, 2023 | | 2023 |
| Highly conductive, printable ink for highly stretchable soft electronics and highly conductive, ultra-stretchable conductors obtainable therefrom H Sun, N Willenbacher US Patent App. 17/431,510, 2022 | | 2022 |
| Thermal improvement of die attach by using PDMS-grafted particles as filler and Its application in solid state lighting K Zhang, X Zhang, Z Chen, H Sun, M Yuen, M Zhang, CY Chan, Y Lee, ... 2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013 | | 2013 |
